SMT is called Surface Mount Technology and is the latest assembly soldering technology in the current processing of electronic components and PCBs. The assembly welding method is to use a screen printer to print the paste on the pad (PAD) of the PCB, and then the pick-and-place machines place the SMD component, resistor, capacitor, inductor, diode, IC, etc., on PCB pad and then reflow soldering (Reflow) to melt the solder paste, so that electronic components and PCB-PAD combined to complete the assembly and welding technology.
SMD size: Smallest 01005, Largest 150x55x25mm
PCB size: Smallest 50x50mm, Largest 750x550mm
The DIP process is a Dual In Line Package Process. This is a technology where components are manually or by auto insertion machine inserted into PCB holes (PTH), and using Flux sprayer, an appropriate amount of flux is sprayed onto the back of the PCB. Then after preheating and dipping in the tin furnace, the liquid tin adheres to the component pins and PCB holes to attach the electronic components to the PCB-PAD, thereby completing the assembly and mounting process, which is briefly referred to as DIP manufacturing process.
We provides professional assembly, testing, inspection, packaging and other services, has a neat, clean production environment and gives customers high-quality products through standardized operating procedures. In order to control the quality, semi-finished products and finished products are tested to reduce the rate of defective products.